The Nano Surface Division of Bruker announced the introduction of the TriboLab CMP Material and Process Characterization System, which provides a unique characterization capability for the development of chemical-mechanical polishing (CMP) processes in the rugged UMT TriboLab mechanical test platform ™. The new TriboLab CMP system is the only tool on the market that can provide a wide range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions and surface temperature measurements for precision and complete Characterization of CMP processes and consumables.
“CMP is more important than ever for the advanced manufacturing of semiconductor devices. The industry has been asking for a means to effectively characterize the detailed process and consumable interactions that take place by polishing a wide range of materials, “said Dr. Robert Rhoades, CTO of Entrepix, a leading supplier of processing equipment and services. from wafers to the CMP industry. “We are pleased to partner with Bruker and help launch the TriboLab CMP platform. With the addition of this new system to our capabilities, we are prepared to provide a reliable R & D solution to test and characterize complex interactions between pads, grouts, packaging and process parameters with incomparable repetition and detail. “
“Bruker has supplied instruments for this application for more than a decade, and we are delighted to present TriboLab CMP as the next generation product of this family. TriboLab CMP has already demonstrated superior capabilities at customer sites in some of the most difficult CMP applications to develop in the semiconductor industry, “added James Earle, Vice President and General Manager of Bruker Tribology, Stylus and Optical Metrology Business. “It is the only tool on the market that can provide the wide ranges of pressure and polishing speed, acoustic emission data, friction and surface temperature for accurate and complete characterization of CMP processes and consumables.”
About TriboLab CMP
Built on the TriboLab UMT mechanical testing platform, the accuracy of the TriboLab CMP system and the repeatability of the measurements allow qualification, inspection and functionality tests that are required throughout the CMP process. TriboLab CMP offers standard on-board diagnostics for a better understanding of the polishing processes, providing radically greater visibility to transient polishing properties. The data is collected from the moment in which the substrate touches the pad and throughout the entire test, which allows decision-making process development in early stages through more complete and detailed data.
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